Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability.
1. Cover image - p. Cover 2. Title page - p. iii 3. Table of Contents - p. iii 4. Copyright - p. iv 5. Dedication - p. v 6. List of Contributors - p. xv 7. Biographies - p. xvii 8. Preface - p. xxi 9. Section I: Scaling - p. xxi 10. Chapter 1. A Perspective on Today’s Scaling Challenges and Possible Future Directions - p. 3 11. Chapter 2. Limits and Hurdles to Continued CMOS Scaling - p. 19 12. Chapter 3. Reliability Issues: Reliability Imposed Limits to Scaling - p. 43 13. Chapter 4. Thermal Engineering at the Limits of the CMOS Era - p. 63 14. Summing Up - p. 103 15. Section II: Thin Film Deposition Equipment & Processing - p. 104 16. Chapter 5. Limits of Gate Dielectrics Scaling - p. 107 17. Chapter 6. Process Technology for Copper Interconnects - p. 147 18. Chapter 7. Sputter Processing - p. 195 19. Chapter 8. Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects - p. 231 20. Chapter 9. Equipment and Manufacturability Issues in Chemical Vapor Deposition Processes - p. 269 21. Chapter 10. Chemical Mechanical Polishing Method and Practice - p. 317 22. Chapter 11. Atomic Layer Deposition: Fundamentals, Practice, and Challenges - p. 359 23. Chapter 12. Optical Thin Films - p. 379 24. Chapter 13. Application of Thin Films in Semiconductor Memories - p. 417 25. Index - p. 439
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability.
1. Cover image - p. Cover 2. Title page - p. iii 3. Table of Contents - p. iii 4. Copyright - p. iv 5. Dedication - p. v 6. List of Contributors - p. xv 7. Biographies - p. xvii 8. Preface - p. xxi 9. Section I: Scaling - p. xxi 10. Chapter 1. A Perspective on Today’s Scaling Challenges and Possible Future Directions - p. 3 11. Chapter 2. Limits and Hurdles to Continued CMOS Scaling - p. 19 12. Chapter 3. Reliability Issues: Reliability Imposed Limits to Scaling - p. 43 13. Chapter 4. Thermal Engineering at the Limits of the CMOS Era - p. 63 14. Summing Up - p. 103 15. Section II: Thin Film Deposition Equipment & Processing - p. 104 16. Chapter 5. Limits of Gate Dielectrics Scaling - p. 107 17. Chapter 6. Process Technology for Copper Interconnects - p. 147 18. Chapter 7. Sputter Processing - p. 195 19. Chapter 8. Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects - p. 231 20. Chapter 9. Equipment and Manufacturability Issues in Chemical Vapor Deposition Processes - p. 269 21. Chapter 10. Chemical Mechanical Polishing Method and Practice - p. 317 22. Chapter 11. Atomic Layer Deposition: Fundamentals, Practice, and Challenges - p. 359 23. Chapter 12. Optical Thin Films - p. 379 24. Chapter 13. Application of Thin Films in Semiconductor Memories - p. 417 25. Index - p. 439
