Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
1. 1. Introduction - p. 1 2. 2. Electrical modeling and design - p. 13 3. 3. Thermal modeling, analysis, and design - p. 59 4. 3.1. Principles of thermal analysis and design - p. 59 5. 3.2. Package-level thermal analysis and design - p. 74 6. 3.3. Numerical modeling - p. 89 7. 3.4. Package-level thermal enhancement - p. 97 8. 3.5. Air cooling for electronic devices with vapor chamber configurations - p. 101 9. 3.6. Liquid cooling for electronic devices - p. 106 10. 3.7. Thermoelectric cooling - p. 112 11. 4. Stress and reliability analysis for interconnects - p. 131 12. 4.1. Fundamental of mechanical properties - p. 131 13. 4.2. Reliability test and analysis methods - p. 149 14. 4.3. Case study of design-for-reliability - p. 227 15. 5. Reliability and failure analysis of encapsulated packages - p. 245 16. 6. Thermal and mechanical tests for packages and materials - p. 293 17. 7. System-level modeling, analysis, and design - p. 325 18. Nomenclature - p. 393 19. Index - p. 403
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
1. 1. Introduction - p. 1 2. 2. Electrical modeling and design - p. 13 3. 3. Thermal modeling, analysis, and design - p. 59 4. 3.1. Principles of thermal analysis and design - p. 59 5. 3.2. Package-level thermal analysis and design - p. 74 6. 3.3. Numerical modeling - p. 89 7. 3.4. Package-level thermal enhancement - p. 97 8. 3.5. Air cooling for electronic devices with vapor chamber configurations - p. 101 9. 3.6. Liquid cooling for electronic devices - p. 106 10. 3.7. Thermoelectric cooling - p. 112 11. 4. Stress and reliability analysis for interconnects - p. 131 12. 4.1. Fundamental of mechanical properties - p. 131 13. 4.2. Reliability test and analysis methods - p. 149 14. 4.3. Case study of design-for-reliability - p. 227 15. 5. Reliability and failure analysis of encapsulated packages - p. 245 16. 6. Thermal and mechanical tests for packages and materials - p. 293 17. 7. System-level modeling, analysis, and design - p. 325 18. Nomenclature - p. 393 19. Index - p. 403
