Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture.
1. Cover image - p. page_i 2. Title page - p. page_i 3. Table of Contents - p. page_i 4. Copyright - p. page_iv 5. Preface - p. page_xiii 6. 1: Highly Accelerated Testing - p. page_1 7. 2: Aging Power Transistors in Operational Conditions - p. page_23 8. 3: Physical Defects Analysis of Mechatronic Systems - p. page_51 9. 4: Impact of Voids in Interconnection Materials - p. page_81 10. 5: Electro-Thermo-Mechanical Modeling - p. page_111 11. 6: Meta-Model Development - p. page_157 12. 7: Probabilistic Study and Optimization of a Solder Interconnect - p. page_189 13. 8: High-Efficiency Architecture for Power Amplifiers - p. page_221 14. 9: Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP) - p. page_247 15. List of Authors - p. page_273 16. Index - p. page_277
Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture.
1. Cover image - p. page_i 2. Title page - p. page_i 3. Table of Contents - p. page_i 4. Copyright - p. page_iv 5. Preface - p. page_xiii 6. 1: Highly Accelerated Testing - p. page_1 7. 2: Aging Power Transistors in Operational Conditions - p. page_23 8. 3: Physical Defects Analysis of Mechatronic Systems - p. page_51 9. 4: Impact of Voids in Interconnection Materials - p. page_81 10. 5: Electro-Thermo-Mechanical Modeling - p. page_111 11. 6: Meta-Model Development - p. page_157 12. 7: Probabilistic Study and Optimization of a Solder Interconnect - p. page_189 13. 8: High-Efficiency Architecture for Power Amplifiers - p. page_221 14. 9: Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP) - p. page_247 15. List of Authors - p. page_273 16. Index - p. page_277
