Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners.
1. Cover image - p. Cover 2. Title page - p. iii 3. Table of Contents - p. iii 4. Copyright - p. iv 5. List of contributors - p. xiii 6. About the editors - p. xvii 7. Preface - p. xix 8. Part 1: Electronics industries - p. xxii 9. Chapter 1. Failures of electronic devices: solder joints failure modes, causes and detection methods - p. 3 10. Chapter 2. Electron beam radiation and its impacts to failure analysis in semiconductor industry - p. 19 11. Chapter 3. Failure of intermetallic solder ball due to stress shielding and amplification effects - p. 71 12. Chapter 4. Assessment of failure of consumer electronics due to indoor corrosion in subtropical climates - p. 87 13. Chapter 5. Pb-free solder—microstructural, material reliability, and failure relationships - p. 107 14. Chapter 6. The role of contamination in the failure of electronics—case studies - p. 153 15. Chapter 7. Analytical solutions for electronic assemblies subjected to shock and vibration loadings - p. 179 16. Chapter 8. Stress analysis of stretchable conductive polymer for electronics circuit application - p. 205 17. Chapter 9. New methodology for qualification, prediction, and lifetime assessment of electronic systems - p. 225 18. Part 2: Textiles industries - p. 270 19. Chapter 10. Failure of yarns in different textile applications - p. 277 20. Chapter 11. Textile failure analysis and mechanical characterization using acoustic emission technique - p. 303 21. Chapter 12. Treatment effect on failure mode of industrial carbon textile at elevated temperature - p. 329 22. Index - p. 355
Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners.
1. Cover image - p. Cover 2. Title page - p. iii 3. Table of Contents - p. iii 4. Copyright - p. iv 5. List of contributors - p. xiii 6. About the editors - p. xvii 7. Preface - p. xix 8. Part 1: Electronics industries - p. xxii 9. Chapter 1. Failures of electronic devices: solder joints failure modes, causes and detection methods - p. 3 10. Chapter 2. Electron beam radiation and its impacts to failure analysis in semiconductor industry - p. 19 11. Chapter 3. Failure of intermetallic solder ball due to stress shielding and amplification effects - p. 71 12. Chapter 4. Assessment of failure of consumer electronics due to indoor corrosion in subtropical climates - p. 87 13. Chapter 5. Pb-free solder—microstructural, material reliability, and failure relationships - p. 107 14. Chapter 6. The role of contamination in the failure of electronics—case studies - p. 153 15. Chapter 7. Analytical solutions for electronic assemblies subjected to shock and vibration loadings - p. 179 16. Chapter 8. Stress analysis of stretchable conductive polymer for electronics circuit application - p. 205 17. Chapter 9. New methodology for qualification, prediction, and lifetime assessment of electronic systems - p. 225 18. Part 2: Textiles industries - p. 270 19. Chapter 10. Failure of yarns in different textile applications - p. 277 20. Chapter 11. Textile failure analysis and mechanical characterization using acoustic emission technique - p. 303 21. Chapter 12. Treatment effect on failure mode of industrial carbon textile at elevated temperature - p. 329 22. Index - p. 355
