Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities.
1. Materials for Electronics Security and Assurance - p. Page i 2. Cover - p. Page i 3. Front Matter - p. Page i 4. Table of Contents - p. Page iii 5. Copyright - p. Page iii 6. Contents - p. Page v 7. About the authors - p. Page v 8. Preface - p. Page vi 9. Acknowledgment - p. Page viii 10. List of Illustrations - p. Page x 11. List of Tables - p. Page xi 12. Chapter 1 : Material for heterogeneous integration: Challenges and opportunities - p. Page xi 13. Chapter 2 : Packaging encapsulant material for hardware assurance - p. Page 16 14. Chapter 3 : Packaging encapsulant material characterization for counterfeit IC detection - p. Page 35 15. Chapter 4 : THz for semiconductor assurance - p. Page 50 16. Chapter 5 : Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance - p. Page 66 17. Chapter 6 : Texture analysis of encapsulant packaging materials - p. Page 78 18. Chapter 7 : MEMS devices in HI packaging - p. Page 102 19. Chapter 8 : Tracking and tracing methods for hardware assurance - p. Page 116 20. Chapter 9 : Sample preparation for hardware assurance - p. Page 128 21. Chapter 10 : Silicon photonic packaging: Complexity and challenges for assurance - p. Page 145 22. Chapter 11 : Advanced IC packaging design for material inspection - p. Page 162 23. Chapter 12 : Electron beam probing for advanced IC packaging assurance - p. Page 179 24. Index - p. Page 196
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities.
1. Materials for Electronics Security and Assurance - p. Page i 2. Cover - p. Page i 3. Front Matter - p. Page i 4. Table of Contents - p. Page iii 5. Copyright - p. Page iii 6. Contents - p. Page v 7. About the authors - p. Page v 8. Preface - p. Page vi 9. Acknowledgment - p. Page viii 10. List of Illustrations - p. Page x 11. List of Tables - p. Page xi 12. Chapter 1 : Material for heterogeneous integration: Challenges and opportunities - p. Page xi 13. Chapter 2 : Packaging encapsulant material for hardware assurance - p. Page 16 14. Chapter 3 : Packaging encapsulant material characterization for counterfeit IC detection - p. Page 35 15. Chapter 4 : THz for semiconductor assurance - p. Page 50 16. Chapter 5 : Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance - p. Page 66 17. Chapter 6 : Texture analysis of encapsulant packaging materials - p. Page 78 18. Chapter 7 : MEMS devices in HI packaging - p. Page 102 19. Chapter 8 : Tracking and tracing methods for hardware assurance - p. Page 116 20. Chapter 9 : Sample preparation for hardware assurance - p. Page 128 21. Chapter 10 : Silicon photonic packaging: Complexity and challenges for assurance - p. Page 145 22. Chapter 11 : Advanced IC packaging design for material inspection - p. Page 162 23. Chapter 12 : Electron beam probing for advanced IC packaging assurance - p. Page 179 24. Index - p. Page 196
