Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects.
The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles.
1. Introduction - p. xi 2. 1: The Fabrication of Micro- and Nanostructures - p. 1 3. 2: Phase Transition: Nucleation, Growth, Aggregation and Coalescence - p. 13 4. 3: The Precipitation of Metals: Thin Film Electroplating and Nanoparticle Synthesis - p. 59 5. 4: Copper Electroplating: from Superconformal to Extreme Fill - p. 71 6. 5: Nucleation and Growth of Metallic Thin Films - p. 107 7. 6: Nucleation and Stabilization of Metallic Nanoparticles in Ionic Liquids - p. 143 8. Appendix 1: Demonstration of the General Expression for the Nucleation Rate - p. 167 9. Appendix 2: Stationary Cluster Population and Nucleation Rate - p. 169 10. Appendix 3: Where is the Surface of the Cluster? - p. 173 11. Glossary - p. 175 12. List of Acronyms - p. 179 13. Bibliography - p. 183 14. Index - p. 193
Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects.
The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles.
1. Introduction - p. xi 2. 1: The Fabrication of Micro- and Nanostructures - p. 1 3. 2: Phase Transition: Nucleation, Growth, Aggregation and Coalescence - p. 13 4. 3: The Precipitation of Metals: Thin Film Electroplating and Nanoparticle Synthesis - p. 59 5. 4: Copper Electroplating: from Superconformal to Extreme Fill - p. 71 6. 5: Nucleation and Growth of Metallic Thin Films - p. 107 7. 6: Nucleation and Stabilization of Metallic Nanoparticles in Ionic Liquids - p. 143 8. Appendix 1: Demonstration of the General Expression for the Nucleation Rate - p. 167 9. Appendix 2: Stationary Cluster Population and Nucleation Rate - p. 169 10. Appendix 3: Where is the Surface of the Cluster? - p. 173 11. Glossary - p. 175 12. List of Acronyms - p. 179 13. Bibliography - p. 183 14. Index - p. 193
