Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.
In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.
Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
1. 1: Introduction - p. x 2. 2: Plastic encapsulant materials - p. 45 3. 3: Encapsulation process technology - p. 121 4. 4: Injection molding - p. 181 5. 5: Compression encapsulation - p. 194 6. 6: Characterization of encapsulant properties - p. 219 7. 7: Encapsulation defects and failures - p. 258 8. 8: Defect and failure analysis techniques for encapsulated microelectronics - p. 315 9. 9: Qualification and quality assurance - p. 373 10. 10: Trends and challenges - p. 429 11. Index - p. 481
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.
In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.
Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
1. 1: Introduction - p. x 2. 2: Plastic encapsulant materials - p. 45 3. 3: Encapsulation process technology - p. 121 4. 4: Injection molding - p. 181 5. 5: Compression encapsulation - p. 194 6. 6: Characterization of encapsulant properties - p. 219 7. 7: Encapsulation defects and failures - p. 258 8. 8: Defect and failure analysis techniques for encapsulated microelectronics - p. 315 9. 9: Qualification and quality assurance - p. 373 10. 10: Trends and challenges - p. 429 11. Index - p. 481
