The Technology of Wafers and Waffles: Operational Aspects is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing.
The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.
1. Chapter One: Introduction - p. xi 2. Chapter Two: Technology of Main Ingredients—Water and Flours - p. 14 3. Abstract - p. 15 4. 2.1 Water—Properties and Functions in Wafer and Waffles - p. 15 5. 2.2 Wheat Flour for Wafer and Waffle Manufacturing - p. 29 6. 2.3 Nonwheat Flours, Starches, Dextrins and Fibres - p. 77 7. Chapter Three: Technology of Main Ingredients—Sweeteners and Lipids - p. 121 8. Abstract - p. 123 9. 3.1 Technology of Sugars, Syrups, Sugar Replacements and Sweeteners - p. 123 10. 3.2 Technology of Oils and Fats for Wafers and Waffles - p. 182 11. 3.3 Lecithin and Other Emulsifiers in Wafers and Waffles - p. 215 12. Chapter Four: Technology of Minor Ingredients for Wafers and Waffles - p. 225 13. Abstract - p. 227 14. 4.1 Introduction and Overview - p. 227 15. 4.2 Physical, Chemical and Biological Leavening - p. 230 16. 4.3 Wafer Enzymes and Chemical Additives - p. 260 17. 4.4 Wafer and Waffle Rework, Baking Scrap - p. 266 18. 4.5 Milk-Based Ingredients - p. 272 19. 4.6 Egg-Based Ingredients - p. 282 20. 4.7 Colouring by Food Colourants and Coloured Foods - p. 302 21. Chapter Five: Adjuncts—Filling Creams, Inclusions, Cacao and Chocolate - p. 312 22. Abstract - p. 313 23. 5.1 Introduction and Overview - p. 313 24. 5.2 Filling Creams on a Sugar–Fat Basis - p. 316 25. 5.3 Filling Cream Alternatives - p. 333 26. 5.4 Inclusions and Toppings - p. 348 27. 5.5 Cocoa and Cocoa Products - p. 355 28. 5.6 Chocolate and Chocolate Surrogates - p. 365 29. 5.7 Enrobing - p. 377 30. 5.8 Minor Applications: Moulding into Chocolate, Panning, Spraying - p. 396 31. Chapter Six: Wafer Sheet Manufacturing: Technology and Products - p. 404 32. Abstract - p. 405 33. 6.1 Introduction and Overview - p. 405 34. 6.2 The Wafer Batter: Recipe, Preparation, and Handling - p. 408 35. 6.3 The Wafer Baking Process: Technical and Operational Side - p. 426 36. 6.4 The Wafer Baking Process: Technology - p. 442 37. 6.5 From the Wafer Sheet to the Sugar Wafer Cookie - p. 464 38. 6.6 Quality Assurance in Wafer Manufacturing - p. 476 39. 6.7 Concluding Remarks: Indulgence and Nutritional Aspects - p. 482 40. 6.8 Wafer Paper - p. 483 41. Chapter Seven: Technology of Other Crisp Wafers - p. 486 42. Chapter Eight: After-Bake Technology of Crisp Wafers and of Soft Waffles - p. 537 43. Chapter Nine: Waffles—An Overview in Products and Technology - p. 586 44. Abstract - p. 587 45. 9.1 Introduction and Overview - p. 587 46. 9.2 The Waffle Compendium - p. 597 47. 9.3 Waffles—Recipe Considerations and Technological Influences - p. 623 48. 9.4 The Functions of Various Waffle Ingredients - p. 632 49. 9.5 The Mixing of the Baking Masses for Waffles - p. 649 50. 9.6 The Baking of Waffles - p. 658 51. 9.7 Waffle Cooling and Packaging - p. 671 52. 9.8 Quality Assurance in Waffles - p. 673 53. Index - p. 679 54. Short Table of Contents of Forthcoming Book - p. 699
The Technology of Wafers and Waffles: Operational Aspects is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing.
The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.
1. Chapter One: Introduction - p. xi 2. Chapter Two: Technology of Main Ingredients—Water and Flours - p. 14 3. Abstract - p. 15 4. 2.1 Water—Properties and Functions in Wafer and Waffles - p. 15 5. 2.2 Wheat Flour for Wafer and Waffle Manufacturing - p. 29 6. 2.3 Nonwheat Flours, Starches, Dextrins and Fibres - p. 77 7. Chapter Three: Technology of Main Ingredients—Sweeteners and Lipids - p. 121 8. Abstract - p. 123 9. 3.1 Technology of Sugars, Syrups, Sugar Replacements and Sweeteners - p. 123 10. 3.2 Technology of Oils and Fats for Wafers and Waffles - p. 182 11. 3.3 Lecithin and Other Emulsifiers in Wafers and Waffles - p. 215 12. Chapter Four: Technology of Minor Ingredients for Wafers and Waffles - p. 225 13. Abstract - p. 227 14. 4.1 Introduction and Overview - p. 227 15. 4.2 Physical, Chemical and Biological Leavening - p. 230 16. 4.3 Wafer Enzymes and Chemical Additives - p. 260 17. 4.4 Wafer and Waffle Rework, Baking Scrap - p. 266 18. 4.5 Milk-Based Ingredients - p. 272 19. 4.6 Egg-Based Ingredients - p. 282 20. 4.7 Colouring by Food Colourants and Coloured Foods - p. 302 21. Chapter Five: Adjuncts—Filling Creams, Inclusions, Cacao and Chocolate - p. 312 22. Abstract - p. 313 23. 5.1 Introduction and Overview - p. 313 24. 5.2 Filling Creams on a Sugar–Fat Basis - p. 316 25. 5.3 Filling Cream Alternatives - p. 333 26. 5.4 Inclusions and Toppings - p. 348 27. 5.5 Cocoa and Cocoa Products - p. 355 28. 5.6 Chocolate and Chocolate Surrogates - p. 365 29. 5.7 Enrobing - p. 377 30. 5.8 Minor Applications: Moulding into Chocolate, Panning, Spraying - p. 396 31. Chapter Six: Wafer Sheet Manufacturing: Technology and Products - p. 404 32. Abstract - p. 405 33. 6.1 Introduction and Overview - p. 405 34. 6.2 The Wafer Batter: Recipe, Preparation, and Handling - p. 408 35. 6.3 The Wafer Baking Process: Technical and Operational Side - p. 426 36. 6.4 The Wafer Baking Process: Technology - p. 442 37. 6.5 From the Wafer Sheet to the Sugar Wafer Cookie - p. 464 38. 6.6 Quality Assurance in Wafer Manufacturing - p. 476 39. 6.7 Concluding Remarks: Indulgence and Nutritional Aspects - p. 482 40. 6.8 Wafer Paper - p. 483 41. Chapter Seven: Technology of Other Crisp Wafers - p. 486 42. Chapter Eight: After-Bake Technology of Crisp Wafers and of Soft Waffles - p. 537 43. Chapter Nine: Waffles—An Overview in Products and Technology - p. 586 44. Abstract - p. 587 45. 9.1 Introduction and Overview - p. 587 46. 9.2 The Waffle Compendium - p. 597 47. 9.3 Waffles—Recipe Considerations and Technological Influences - p. 623 48. 9.4 The Functions of Various Waffle Ingredients - p. 632 49. 9.5 The Mixing of the Baking Masses for Waffles - p. 649 50. 9.6 The Baking of Waffles - p. 658 51. 9.7 Waffle Cooling and Packaging - p. 671 52. 9.8 Quality Assurance in Waffles - p. 673 53. Index - p. 679 54. Short Table of Contents of Forthcoming Book - p. 699
